860 is a thermally conductive silicone paste. It is designed to reduce thermal resistance between irregular metal surfaces. It is most commonly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.
Features and Benefits
High thermal conductivity
High dielectric strength
Broad service temperature of -40 to 200 °C (-40 to 392 °F)